All ADI
Texas Instruments
MPS
TI(德州仪器)
TE Connectivity(泰科电子)
ROHM
Tagore
ST
Slkor(萨科微)
TOREX
RENESAS
Qorvo
PHILIPS(飞利浦)
PASTERNACK
PANASONIC(松下)
onsemi
NTE ELECTRONICS, INC.
Nisshinbo
MOTOROLA(摩托罗拉)
Mini-Circuits
L3HARRIS
JRC
Integra Technologies
Infineon
II-VI / Finisar
HUBER+SUHNER
Hittite
HARRIS(哈利斯)
Guerrilla RF
DIODES
Crystek
CMLMICRO
California Eastern Laboratories
Broadcom/AVAGO(安华高)
Broadcom(博通)
Bolton Technical
BeRex
Atlanta Micro Inc.
Ampleon(安谱隆)
Amphenol
ALLEGRO(美国埃戈罗)
AKM
AEI
MAXIM
SKYWORKS
NXP
MICROCHIP
MACOM
HARRIS
| नमूना | उत्पादक | पैकेट | पैकिंग विधि | पैकेजिंग मात्रा (न्यूनतम) | विवरण | उद्धरण प्राप्त करें |
|---|---|---|---|---|---|---|
| MC33FS8430G2ES | NXP | - | 260 | - |
|
|
| BGA3031J | NXP | HVQFN-20-EP(5x5) | TAPE | 6000 | - |
|
| A2I09VD030GNR1 | NXP | TO-270WBG-15 | TAPE | 500 | Gain: 34.3dB, power supply voltage: 48V |
|
| TEA1713T/N2,518 | NXP | SOIC-24-300mil | 1000 | 70V~276V, switching frequency: 500kHz, operating temperature: -40℃~+150℃ |
|
|
| MC33882PEKR2 | NXP | SOIC-32-EP-300mil | 1000 | - |
|
|
| MMPF0200F3AEP | NXP | HVQFN-56-EP(8x8) | 260 | - |
|
|
| MFS8632BMDA0ES | NXP | 4QFN-8(7x7) | 260 | - |
|
|
| BGU8063J | NXP | HVSON-10-EP(3x3) | TAPE | 6000 | - |
|
| MCP6001T-1/0T | NXP | - | TAPE | 3000 | - |
|
| TEA1791AT/N1,118 | NXP | SO-8 | 2500 | 8.5V~38V, operating temperature: -40℃~+150℃ |
|
|
| MC33882PEP | NXP | QFN-32-EP(7x7) | 260 | - |
|
|
| MC33PF8100EQESR2 | NXP | HVQFN-56-EP(8x8) | 4000 | - |
|
