नमूना उत्पादक पैकेट पैकिंग विधि पैकेजिंग मात्रा (न्यूनतम) विवरण उद्धरण प्राप्त करें
MPF7100BVBA0ES NXP HVQFN-48(7x7) 260 -
BGA2874,115 NXP TSSOP-6-1.3mm TAPE 3000 -
TDA8954TH/N1 NXP HSOP-24-11mm TAPE 2000 -
TEA1998TS/1H NXP TSOP-6-1.5mm 3000 Working temperature: -40℃~+150℃
MC33883HEGR2 NXP SOIC-20-300mil 300 -
MC34PF3000A0EP NXP VQFN-48-EP(7x7) 260 -
MVR5510AVMALEP NXP HVQFN-56(8x8) 260 -
BGA7210X NXP HVQFN-32-EP(5x5) TAPE 1500 -
TDA8954J/N1 NXP DBS-23 TAPE 1 -
TEA1999TK/2J NXP HVSON-8-EP(3x3) 12000 Working temperature: -40℃~+150℃@(TJ)
UBA2033TS/N3118 NXP - 1000 -
MC34PF3000A4EP NXP QFN-48-EP(7x7) 260 -